QUALITY MANAGEMENT

FS Electronics knows that no one wants to get bad quality parts, each electronic part on the PCBs is significant.

In order to ensure the component quality, reduce the risk for our customers, we’re implementing a highly effective quality management system as well as an environmental protection system, which is continuously maintained for process improvements in accordance with the requirements of ISO standards.

  • FS ISO9001
    FS ISO9001

    ISO9001:2015

  • FS ISO14001
    FS ISO14001

    ISO14001:2015

ORIGINALITY

100% 

WARRANTY DAYS

365+

SATISFACTION

99.6%

VETERAN QC TEAM

FS Electronics has a veteran team of about 60 guys with an average experience of 10 years in Quality Management.
To evaluate the continuous suitability of FS’s quality system, our expert team consistently reviews the quality system by internal audit as well as quality records, consisting of outcomes of audits, client feedback, process efficiency, as well as product consistency, etc.
All the staff must get through quality task training at routine intervals, understanding the relevance as well as the significance of their work efficiency and also exactly how this guarantee our quality goals.

  • electronic parts warehouse
  • FS QC team
  • FS QC team 2

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Verifies the box damages, ESD protection, type of package, humidity indicator card (HIC) passing H2O test, etc. This testing is non-destructive and performed in accordance with SAE AS6081, 4.2.6.4.1.

Verifies the characteristics of electronic parts to evaluate quality, including inceptions such as the condition of the components, part markings, evidence of a secondary coating, lead conditions, dimensions, and surface quality. Visual inspection is performed following SAE AS6081 and MIL-STD-883 Method 2009.9 and on a sample of parts from a given lot base on the sample according to the ANSI ASQE Z1.4 Table II−A.

Visual inspection items contain:

  • Package condition and dimension of the product
  • Device markings and signs of remarking
  • Body inspection to identify scratches, cracks, corrosion, contamination, markings, coatings, etc
  • Pin indicator orientation, texture, coating, dimensions
  • Lead condition (oxidation, alignment, exposure, corrosion, etc)
  • BGA inspection for broken, damaged, or displaced BGA’s
  • Substrate condition

Verifies electrical operating conditions of active and passive components on various types of components from limited DC function to full DC/AC function. This is performed in accordance with MIL-STD-883 and the manufacturer’s specifications. We can simulate test conditions depending on industry compliance requirements (i.e., Military, Automotive, Medical, etc.).

A measure of the ease with which a soldered joint can be made to that material. It determines if the electric component will have soldering issues at the contract manufacturer. The joint standard J-STD-002 defines the test methods and accept/reject criteria for thru-hole, surface mount, and BGA devices. For non-BGA surface mount devices, the dip-and-look is employed and the “ceramic plate test” for BGA devices has recently been incorporated into our suite of services. This destructive test is performed per MIL-STD-883 Method 203.8 and J-STD-002.

Decapsulation tests can be provided for customers to ensure that the original manufacturer has produced the device. This destructive test will expose the die, and characteristics such as die markings, and metallization damage due to ESD or corrosion will be verified. Decapsulation is usually performed on 1 sample per lot/date code based on MIL-STD-883, Method 2014 or AS6081, 4.2.6.4.6. A decapsulation test exposes the internal structure of the device by removing the exterior of the device. This is often achieved using an acid mixture to expose the bonding wires, internal structure, and die.

X-ray gets implemented to verify the bond wire connections, die size comparison, and ESD damage. X-Ray is performed based on AS6081 4.2.6.4.4 and MIL-STD-883 2012.7. Counterfeit devices can be determined by comparing the structure of the die to a known good device.

Analysis items:

  • Broken or Missing Bond Wires
  • Wire Bonding Options
  • Void Analysis
  • Check for De-lamination
  • Structure Analysis
  • Die Size Comparison
whitehorse

SUPPLIER EVALUATION

Supplier evaluation is critical for FS Electronics because the source of components has a direct influence on parts quality. Therefore, we consistently follow ISO9001:2015 standards and build our supply chain very strictly, only high-qualification sources in.


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We also evaluate all the sources on a quarterly basis. The evaluations are based on previous experiences, experiences of our partners, and financial, social, and certification reviews. The suppliers may also receive a visit from a member of our quality assurance team.

All new sources are requested to send their samples to our 3rd party testing laboratories (CECC/White horse), where we perform detailed testing analysis of the product.